The sensor chips are offered in both single and dual die versions for systems that require redundant sensors. They both include on-chip EEPROM, capable of supporting up to 100 read/write cycles, for end-of-line programming of calibration parameters. Both devices are designed for automotive applications requiring 0° to 360° angle measurements, such as motor position measurements for steering and braking systems as well as for high speed actuators for pumps and transmissions that require low latency and high resolution. The A1339 also includes an integrated turns counter and low power mode features that enable it to track changes in the target magnetic field in automotive applications even when the vehicle is in the “key off” state.
Both devices were designed in accordance with ISO26262:2011 requirements for hardware development (pending assessment). The single die versions were targeted to meet ASIL B requirements; the dual die products will meet ASIL D requirements when integrated and used in conjunction with the appropriate system level control. The stacked die nature of the dual die assembly provides better channel-to-channel matching than more traditional side-by-side assembly techniques. This is a key parameter for safety critical applications where the output of the two sensors is compared to insure that the system is operating safely.