Automotive power MOSFETs offer space savings without compromising performance

November 13, 2013 // By Paul Buckley
Toshiba Electronics Europe (TEE) has expanded the company's family of power MOSFETs for automotive applications with three new miniature package formats that will help designers make PCB space savings without compromising performance.

The TPCA8xxx, TPCC8xxx and TPCP8xxx series of MOSFETs offer N-channel and P-channel variants and are provided in SOP Advance, TSON Advance and PS-8 package formats respectively. Respective dimensions are 5 mm x 6 mm x 0.95 mm; 3.3 mm x 3.3 mm x 0.85 mm and 2.8 mm x 2.9 mm x 0.8 mm. All of the new devices are 175°C rated and feature low on resistance and low input capacitance leading to low conduction and switching power loss. SOP Advance and TSON Advance packages have bottom-side metal heat slugs to conduct heat better than conventional miniature packages, such as SOP-8.

Toshiba’s SOP-Advance devices are ideal for mid-power applications where DPAK devices are conventionally used. TSON advance and PS-8 devices can replace SOP-8 devices and save board space.

The new TPCA8xxx SOP-Advance MOSFETs offer voltage and current ratings up to +60V and 40A for N-channel devices and -60 V and -35 A for P-channel devices. The TPCC8xxx TSON Advance series features voltages and currents to +60 V/-60 V and +30/-30 A. TPCP8xxx N-channel PS-8 MOSFETs can be supplied as single-channel devices with ratings to +60 V and 10 A or in a dual-channel version rated to 40 V and 5 A. P-channel TPCP8xxx MOSFETs are available for voltages and currents up to -60 V and -8 A.

In addition Toshiba can supply a PS-8 packaged device that combines a 40 V, 5A N-channel MOSFET and a -40 V, -4 A P-channel MOSFET in the same ultra-miniature package.

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