A multi-purpose, high-performance DSP for compute-intensive system-on-chip (SoC) designs, Cadence presents the Fusion G3 DSP as exceptionally easy to program for use in automotive, consumer, internet-of-things (IoT) and industrial applications that combine intensive audio, imaging, communications, radar and embedded DSP computation.
“As we continue to broaden our customer base, we are solving a wider range of SoC challenges. The flexibility of the new Tensilica Fusion G3 DSP is perfect for customers running a diverse set of software applications,” stated Steve Roddy, senior group director of product marketing for Tensilica in the IP Group at Cadence. “With advanced development tools including auto-vectorization and extensive library support, the Tensilica Fusion G3 DSP provides our customers with an easy development flow and higher performance out-of-the-box for their next-generation applications. Even those with extensive floating-point performance requirements can quickly port existing code to the Tensilica Fusion G3 DSP with the optional Vector Floating-Point unit.”
The Tensilica Fusion G3 DSP expands on the multi-purpose Tensilica Fusion DSP product family introduced in 2015. When compared to the Tensilica Fusion F1 DSP , the Fusion G3 DSP shares the same base Xtensa instruction-set architecture (ISA), while adding richer and higher-throughput DSP instructions. Suited to more compute-intensive applications including radar, imaging and mid- to high-end audio pre/post-processing, it delivers this performance with quad 32-bit integer MACs and quad single-precision 32-bit floating-point MACs.