D2PAK+ 1.5 mΩ MOSFETs for automotive applications

October 24, 2016 // By Graham Prophet
Toshiba Electronics Europe's TK1R5R04PB is the first device in its low-resistance D2PAK+ package. While the D2PAK+ has the same footprint as a conventional D2PAK (or TO-263) package, it offers reduced package resistance thanks to a source pin that is much wider near to the mould surface than that of a conventional D2PAK.

The TK1R5R04PB is rated for 40V and 160A and has a maximum on resistance of 1.5 mΩ (VGS = 10V). Minimum and maximum voltage threshold ratings (Vth) are 2V and 3V respectively. Toshiba’s UMOS IX-H wafer process has been used to produce the TK1R5R04PB. U-MOS IX-H has an excellent switching ripple suppression capability and can contribute to EMI noise reduction in applications. Target applications for the new device include automotive pumps, fans, DC-DC converters and load switches; the TK1R5R04PB will conform with AEC-Q101 automotive level qualification requirements.


Toshiba Electronics Europe; www.toshiba.semicon-storage.com