Industry’s first stacked CMOS image sensor for automotive use: Page 2 of 2

October 31, 2017 // By Christoph Hammerschmidt
With its IMX324 image sensor, Sony breaks new ground in the design of automotive-grade image sensors in several ways. The sensor not only offers higher resolution than available products, it is also the first time that the stacked configuration is used for automotive-grade image chips. Plus, the image sensor offers functional safety and data security features.

This sensor is planned to meet the AEC-Q100 Grade 2 reliability testing standards for automotive electronic components by June 2018, when the test and certification process will be completed. Sony has also introduced a development process compliant with ISO 26262 automobile functional safety standards, to ensure design quality that satisfies the functional safety requirements for automotive products, and this has led to its supporting functional safety requirement level ASIL B for failure detection, notification, and control. Moreover, the new sensor comes with a security feature that protects the output image from being altered, which is the industry’s first application of such a function in an image sensor for automotive cameras.

More information: http://www.sony.net/

 

 


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