Renesas, Dibotics devise smart Lidar platform

December 18, 2017 // By Christoph Hammerschmidt
Chipmaker Renesas has entered a collaboration with 3D Lidar technology expert Dibotics (Paris, France) to develop an automotive-grade embedded solution for Lidar processing used in advanced driver assistance systems (ADAS) and automated driving applications. The solution will enable system automotive tier ones to develop real-time 3D mapping systems with high level functional safety (FuSa) and low-power consumption.

Lidar processing requires efficient processing platforms and advanced embedded software. By combining Renesas’ image processing automotive R-Car system-on-chip (SoC) with Dibotics’ 3D simultaneous localization and mapping (SLAM) technology, the companies deliver a SLAM on Chip. SLAM is a computational algorithm capable of generating and updating a map of an unknown environment while simultaneously keeping track of the vehicle’s location. SLAM on Chip realizes SLAM technology on a SoC.

The planned SLAM on Chip implements 3D SLAM processing on a SoC, a function that typically used to require a high-performance PC. It also realizes 3D mapping with Lidar data only, eliminating the need to use inertial measurement units (IMUs) and global positioning system (GPS) data. The collaboration enables a real-time 3D mapping system with low power consumption and high-level functional safety in automotive systems.

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