Single-chip solution drives graphics for HUDs, Instrument clusters

August 25, 2016 // By Christoph Hammerschmidt
More memory space, smaller footprint: These are the major features of Cypress Semiconductor’s new members of the company’s Traveo automotive microcontroller family. The single-chip solution is designed to drive graphics on head-up displays, traditional gauges and hybrid instrument cluster applications. As a heritage from the Spansion takeover, the devices come with the low-pin-count HyperBus memory interface.

The Traveo S6J32xE series features up to 4MB of high-density embedded flash, 512 KB RAM and 2 MB of Video RAM, along with an ARM Cortex-R5 core at 240 MHz performance. The MCUs have up to two 12-pin HyperBus memory interfaces that improve read and write performance of graphical data and other data or code. The devices can use a single HyperBus interface to connect to two memories for Firmware Over-The-Air (FOTA) updates, which enable end-users to get new software fixes, features and applications for their vehicles on-the-go. The series includes a Low-voltage Differential Signaling (LVDS) video output, providing a suitable interface to attach external displays such as Thin-Film-Transistors (TFTs). The MCUs support all in-vehicle networking standards required for instrument clusters, including Controller Area Network-Flexible Data (CAN-FD) and Ethernet AVB.


With the new MCUs, Cypress is addressing the strong growth trend of hybrid clusters and head-up displays, the company explained.


The new Traveo derivatives from the S6J32xE series integrate enhanced secure hardware extension (eSHE) for robust security. The HyperBus interface enables seamless connections with Cypress’s HyperFlash and HyperRAM memories, which deliver read/write bandwidth of up to 200 MBps per channel in combination with Traveo MCUs. The MCUs include 50 channels of 12-bit Analog to Digital Converters (ADC), 12 channels of multi-function serial interfaces and I2S interfaces and an AUDIO DAC to output the complex, high-quality sounds required in today’s instrument clusters. Support for Ethernet AVB delivers increased bandwidth in multimedia applications and reduced programming time, while a MediaLB interface enables communication with legacy media communication systems. The S6J32xE series supports a wide ambient temperature range of -40°C to +105°C.


The Traveo S6J32xE series is sampling now and will be in production in the early 2017. The MCUs are available in TEQFP-208 and TEQFP-216 packages.


More information on the Traveo MCU family is available at


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Spansion supplements HyperBus system with fast memory