The new products meet AEC-Q100 Grade 2 requirements, support the wide temperature range of -40 to +105°C, and offer the enhanced reliability capabilities that are required by increasingly complex automotive applications.
The chips integrate NAND built using a 15nm process with a controller in a single package. Capacities of 16GB, 32GB, 64GB and 128GB all in a 11.5x13.0x1.2mm package and a 256GB version in a 12.0x16.0x1.6mm package support a variety of automotive applications. These include infotainment, which typically needs high-capacity storage, and wireless communications, which may need only a small capacity. Utilising the UFS interface allows the new products to achieve sequential read of 850MB/s and random read of 50kIOPs, which are approximately 2.7 times and 7.1 times faster than their current e-MMC counterparts, respectively.
Other new functions specifically suited to automotive applications have been added to the new UFS products, including Refresh, Thermal Control and Extended Diagnosis. Refresh can be used to refresh data stored in the UFS and can contribute to the extension of the data’s life span. Thermal Control protects against overheating in the high temperatures that can occur in automotive applications. Extended Diagnosis helps users to understand the condition of the product.
Toshiba Memory Europe - http://toshiba.semicon-storage.com