Zynq-based module addresses complex embedded system designs

March 04, 2016 // By Christoph Hammerschmidt
Trenz Electronic, a provider of FPGA and SoC-based electronic design services and solutions, has launched the TE0808 UltraSoM+ high-performance, industrial grade system-on-module delivering advanced technologies packed into an extremely compact form factor. The TE0808 UltraSoM+ delivers the levels of performance demanded by next generation multi-tasking embedded systems in the automotive, broadcast, communications, industrial, medical, mil/aero, and T&M markets.

The TE0808 UltraSoM+ system-on-module integrates Xilinx’s Zynq UltraScale+ MPSoC with up to 4GB of DDR4 SDRAM main memory with 32-bit width, up to 512MB of Flash memory for configuration and operation, and assembly options to add additional volatile or non-volatile memory. Supported are Micron XTRMFlash and Spansion/Cypress HyperRAM or HyperFlash devices. Also integrated is an onboard switch-mode power delivery subsystem that includes 14 DC/DC converters and 13 LDO regulators controlled by an ultra-low power MCU to provide flexible power-saving modes. Rugged board-to-board stacking connectors provide a total of 480 terminals supporting high-speed transceiver I/O’s to the processing system and programmable logic in the FPGA part. An ultra-low jitter PLL provides all required clocks to the 20 serial transceivers.


With the Zynq UltraScale+ MPSoC as its processing engine, the TE0808 UltraSoM+ system-on-module provides design engineers with a versatile, all programmable heterogeneous multiprocessing environment for the development of next-generation embedded systems. Such systems include advanced driver assistance systems (ADAS), and industrial IoT applications. It delivers maximum scalability through a flexible 32/64-bit data-width processing system. The system can offload critical applications like graphics and video pipelining to dedicated processing blocks, as well as turn blocks on and off through efficient power domains and gated power islands. With a wide range of connectivity options, DSP architectural blocks, on-chip memory, and programmable logic capacity, fits for cost-sensitive, single platform, high-performance applications using industry-standard tools. In addition, the upcoming UltraITX+ companion baseboard enables the TE0808 UltraSoM+ to be installed in standard PC enclosures.


Further information: www.trenz-electronic.de