manufacturing conditions of a high-volume automotive production.
One solution for this problem is to design a path for the induced RF current from the harness to GND with a very low impedance beside the signal paths of the sensor system. The conductive case of the module can provide this path and shield the module’s PCB from radiated RF signals in the GHz range. Another benefit of this construction concept is that the conditions of the SASEM’s assembly inside the car cannot decrease its electromagnetic immunity because with its design, the worst case conditions (see configuration 10 above) are considered.
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Article by courtesy of EE Times Design .