How joint qualification of new memory devices helps to improve system quality, as well as chip quality: Page 6 of 6

October 21, 2016 //By Marcel Kuba
How joint qualification of new memory devices helps to improve system quality, as well as chip quality
Engineers in the automotive industry are subject to conflicting pressures. On the one hand, they are always looking for new products and technologies that will help to solve the pressing design problems that they face.

To close, here are – drawn from Cypress’s experience – the ten essential elements of a successful joint qualification:

  1. Focus on the known critical parameters first; only then add more at the customer’s request.
  2. Perform MCU-Flash interface timing analysis, and review the timing set-up (boot, fast SDR or DDR read, burst read, page read).
  3. Review typical device usage (program/erase history, sector usage mapping, flash file system, and software usage).
  4. Test Vcc to +100mV over spec. Check noise, and confirm that Vcc is stable.
  5. Test temperature to +5° over spec.
  6. Review design and loading.
  7. Check for bit-flip robustness and ECC.
  8. Evaluate the impact of customer production processes or application usage profiles on bit integrity.
  9. Cycle through program/erase steps.
  10. Test for mechanical stresses arising from fabrication.

 

About the author:

Marcel Kuba is Worldwide Director of Field Applications Engineering (Automotive) at Cypress Semiconductor - www.cypress.com

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