Bluetooth LE SoC is automotive-qualified
The TC35679 provides Bluetooth HCI (Host Control Interface) and Low Energy GATT profile functions (according to Bluetooth specifications). In conjunction with an external non-volatile memory, the new IC becomes a fully-fledged application processor. Alternatively, the TC35679 can be combined with an external host processor.
The IC is based on an ARM Cortex M0 processor and includes a 384 kB ROM mask to support the Bluetooth baseband process as well as 192 kB RAM for storing user programs and data.
A key feature of the TC35679 is that it can be used as a component in sophisticated systems thanks to 17 GPIO (General Purpose IO) lines and several communication options including SPI, I2C and a dual-channel 921.6 kbps UART. The GPIO lines provide access to integrated functions such as wake-up interface, four-channel PWM interface, six-channel A/D converter and the ability to control the control interface of an optional external RF power amplifier for long-range applications. DC/DC converters or LDOs on the chip adapt the external supply voltage to the required values on the chip.
The low-energy IC is fully qualified according to the automotive quality standard AEC-Q100 and is primarily intended for use in automotive applications. Current applications include remote key systems and wireless connections to sensors to reduce the number of cables. In addition, the module enables radio communication with diagnostic devices. In this way, a Bluetooth ‘Soft’ OBD port (on-board diagnostics) can be realized and the costs and weight of the associated cabling and OBD connectors can be reduced.
The TC35679 comes in a low-profile QFN housing. The IC operates in a wide range of supply voltages (1.8 to 3.6 V) and is designed for operating temperatures from -40 to +105°C.
More information: https://toshiba.semicon-storage.com/eu/top.html