EnSilica chassis control ASIC enters mass production

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By Christoph Hammerschmidt

The complex mixed-signal ASIC uses a BCD process with high-voltage transistors, and combines extensive monitoring and fault detection circuits (for example open and short pins, over and under voltage detection and frequency monitoring) with duplicate redundancy on key functions.

The part is qualified to AEC-Q100 grade 0, EnSilica’s in-house functional safety team developed the ASIC to meet the requirement defined in ISO26262 to the most demanding Automotive Safety Integrity Level (ASIL-D).

Development of the ASIC began in mid 2018 and was signed off for production earlier this year.  Design was undertaken by EnSilica, in close collaboration with leading independent semiconductor testing and qualification firm, RoodMicrotec N.V.

EnSilica selected RoodMicrotec N.V. to support it in the qualification and testing of this mixed signal automotive ASIC. RoodMicrotec N.V. will undertake final testing of the ASIC in its in Nördlingen, Germany facility.

The device will first be used in a recently launched flagship model from an unnamed premium OEM and is anticipated to be then rolled out to additional vehicles in its range. Depending on the model variant, up to 24 of the chassis-control devices will be used per vehicle.

2.5 million ASIC devices will ship to the luxury carmaker during the next 12 months, with an anticipated production life of seven years.

“Our design team were able to deliver the first silicon samples in less than 12 months, given the complexity of this mixed signal chip and the added overhead of complying to the ISO 26262 at ASIL-D, this was real achievement,” commented Ian Lankshear, Chief Executive Officer of EnSilica plc. “Both RoodMicrotec and EnSilica’s teams worked well together to take this through AEC-Q100 qualification, test program development and then preparing it for automotive quality production sign-off.”


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