Semikron integrates ST’s SiC devices into EV power modules

Semikron integrates ST’s SiC devices into EV power modules
Business news |
STMicroelectronics will supply silicon carbide (SiC) technology for Semikron's eMPack power modules for use in next-gen electric vehicles (EVs). Semikron already received a billion-euro order for these parts.
By Christoph Hammerschmidt

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The integration of STM’s SiC devices into Semikron’s power modules is the result of four years of technical collaboration between the two companies to date, with the aim of using ST’s advanced SiC power semiconductors to offer very high efficiency products that are also very compact.

SiC is fast becoming the automotive industry’s power technology of choice for EV powertrains, where it helps improve range and reliability. Semikron recently announced the receipt of a billion-euro order to supply its innovative eMPack power modules to a German automaker starting in 2025.

“ST’s industry-leading capabilities in SiC device production, as well as the company’s deep expertise in this technology, has enabled us to integrate these leading-edge semiconductor devices with our advanced manufacturing processes that improve reliability, power density and scalability as specified by the automotive industry,” explains Karl-Heinz Gaubatz, Semikron’s chief executive officer (CEO) and chief technical officer (CTO). “In advance of future volume production, our cooperation with ST provides us with the assurance of a robust supply chain that offers control over quality and delivery performance.”

“Based on our SiC technology, Semikron’s scalable power modules of the eMPack family are able to make an important contribution to zero-emission motorisation,” commented Edoardo Merli, General Manager of the Power Transistor Sub-Group and Executive Vice President of STMicroelectronics.

ST’s third-generation SiC technology features industry-leading process stability and performance. Working together, engineers from ST and Semikron integrated the advanced STPOWER SiC MOSFETs that control switching in the electric vehicle’s main traction inverter into Semikron’s innovative, fully sintered DPD (Direct Pressed Die) assembly process. DPD technology not only improves the performance and reliability of the modules, but also allows their power and voltage to be scaled cost-effectively. Using the parameters of ST’s SiC MOSFETs supplied in bare die form, Semikron has been able to create eMPack platforms with nominal voltages of 750 V and 1,200 V, designed for applications with power ratings from 100 kW to 750 kW, as well as for 400 V and 800 V battery systems.

ST currently produces a broad portfolio of STPOWER SiC MOSFETs, which are offered in standard power packages or as bare die. The latter are ideally suited for advanced modules where high power density is high on the priority list.

https://www.semikron.com/

www.st.com

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