Ultra-flat PCB process for high parallel vertical probe card applications
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By
eeNews Europe
Leveraging the knowledge of PCB stack up engineering and PCB construction, Multitest developed the “UltraFlat” process to meet these requirements. UltraFlat allows for a very tight overall flatness tolerance to be maintained by removing the bow/twist in the PCB. Unlike "flat-baking" that provides a temporarily flat PCB, Mutltitest’s UltraFlat process provides a permanent overall flatness for the PCB. With UltraFlat, Multitest typically is able to comply with bow/twist requirements of 1.0 percent.
More information at www.multitest.com/pcb.
Visit Multitest at www.multitest.com
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