40V low RDS(on) MOSFET series targets space-constraint applications

February 21, 2019 //By Christoph Hammerschmidt
40V low RDS(on) MOSFET series targets space-constraint applications
Former NXP spin-off Nexperia has launched a new family of MOSFETs for space-constricted automotive powertrain applications with. Common denominators of the family based on Nexperia’s Trench 9 technology are low RDS(on) and very compact dimensions. Target applications include space-constricted, increased-power modules in demanding powertrain applications.

The new 40 V MOSFETs are housed in the miniature, LFPAK33 package which has a footprint of only 10.9 mm² and a pitch of just 0.65 mm, devices use Nexperia’s Trench 9 technology. This results in a reduction in RDS(on) of 48% when compared to previous technology devices, covering a range of applications from 30 W up to 300 W. BUK7M3R3-40H and BUK9M3R3-40H (Standard Level and Logic Level) devices feature an RDS(on) of just 3.3 mΩ.

Improved RDS(on) and current capability allows the LFPAK33 package to replace larger power styles at a lower cost with comparable product performance, where traditionally DPAK-packaged devices which are 80% larger than LFPAK33 devices have been used. Rugged, Trench 9 Superjunction technology also delivers a higher Avalanche capability and greater Safe Operating Area (SOA) for improved performance under fault conditions.

The devices are qualified to AEC-Q101 exceeding the requirements of this standard by more than two times.

More information: https://efficiencywins.nexperia.com/efficient-products/lfpak33-drives-300-watt-powertrain-systems.html


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