Advantest expands chip test platform to cover automotive ICs

October 22, 2019 //By Christoph Hammerschmidt
Advantest expands chip test platform to cover automotive chips
As the use of semiconductors in vehicles is increasingly and integrated circuits are ubiquitous in many automotive systems from powertrains to ADAS, the necessity for semiconductor manufacturers to establish adequate test solutions is taking center stage. Therefore, test equipment supplier Advantest Corp. as introduced two new modules ans a test head designed specifically for high-volume testing of devices used in automotive applications.

The new equipment is designed to enhance test coverage, enable higher parallelism and reduce the cost of test for system-on-chip (SoC) devices used in automobiles. With the two new products, Advantest is expanding the range of its T2000 platform.

The new RND520 test head has 52 slots, providing the highest pin count available with Advantest’s direct-dock testing option. As a member of the HIFIX (high-fidelity tester access fixture) product line, the test head supports massively parallel wafer-sort testing. It covers an area 40 percent larger than its predecessor while using center-clamp technology to ensure stable contact during wafer sorting. In addition, the test head can operate over an extended temperature range up to 175° C.

The enhanced 2GDME digital module leverages 256 channels to test a wide range of SoC devices used in automotive electronics including MCUs, APUs, ASICs and FPGAs operating at speeds up to 2 gigabits per second (Gbps). It features a dedicated high-performance parametric measurement unit (HPMU) for every 32 I/O channels, giving the unit an expanded current capacity up to 60 milliamperes (mA) for every I/O channel. The module also supports high-voltage applications by enabling electrical stress testing and arbitrary waveform generator (AWG) and digitizer (DGT) functions valuable for characterization purposes.

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