The new products are embedded NAND flash memory devices that integrate BiCS Flash 3D flash memory and a controller in a single 153-ball FPGA package. They include a HS-G3 interface and operate from two supply voltages: 3.3V for the memory core and 1.8V for the interface circuitry.
With connected cars and autonomous vehicles expected to generate enormous quantities of data, the storage requirements for automotive applications will continue to increase. TME’s BiCS Flash-enabled UFS devices provide customers with an option that is better suited to support their high-performance and density needs than existing e-MMC and UFS devices. For example, the 256GB product’s sequential read and write performance are improved by approximately 6 % and 33 %, respectively, over previous generation device.
The performance benefits of UFS have made it the mainstream memory choice for high-end and mid-tier smartphones and as automotive applications increase in complexity and data storage needs, UFS is expected to become the solution of choice in those applications.
Several functions have been added to TME’s Automotive UFS, such as refresh, thermal control and extended diagnosis, which are well-suited to the requirements of automotive applications. The refresh function can be used to refresh data stored in UFS and helps to extend the data’s lifespan. The thermal control function protects the device from overheating in the high-temperature environment that can occur in automotive applications. Lastly, the extended diagnosis function helps users easily understand the device’s status.
More information: https://business.toshiba-memory.com/en-emea/top.html