Embedded power chips make electric cars more reliable

May 06, 2019 //By Christoph Hammerschmidt
Embedded power chips make electric cars more reliable
Infineon and the printed circuit board manufacturer Schweizer Electronic AG have developed a new technology for mild hybrid vehicles: chip embedding of power MOSFETs. The technology increases the performance of 48 V systems while reducing their complexity.

In chip embedding, the power MOSFETs are not soldered to boards as before, but integrated into them. The thermal advantages associated with this should enable a significantly higher power density; in addition, this technology increases system reliability, says Dr. Frank Findeis, who is responsible for Infineon's business with automotive MOSFETs. "The bottom line is that system developers can increase the performance of a 48 V system or make it more cost-efficient.

Continental Powertrain is the first user to decide to use this technology. "Chip embedding of Power MOSFETs opens up completely new possibilities for the electrification of mild hybrid vehicles," says Dr. Rolf Merte, CEO at Schweizer Electronic. "The fact that one of the world's leading automotive suppliers has opted for our technology underlines its potential.

Continental Powertrain uses the technology in a 48 V starter generator for vehicles of a major European car manufacturer. "Chip embedding allows us to increase performance by 60 percent compared to a conventional system," explains Dietmar Vogt, System Technical Project Leader at Continental Powertrain.

48 V starter generators make a major contribution to the fact that mild hybrid vehicles emit up to around 15 percent less CO₂ than with conventional powertrains. With them, the engine can stop more frequently and longer than with a 12 V start-stop system. They can also reduce the load on the combustion engine by boosting when accelerating. When braking, they recuperate more kinetic energy than a 12 V system.

Infineon contributes its leading MOSFET technology OptiMOS 5 to the new approach, Schweizer its embedding technology Smart p² Pack. The partners plan to start mass production in 2021.

 

Related articles:

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Continental expands electromobility activities in China

 


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