MicroVision & STMicroelectronics team on MEMS HUD technology

November 11, 2016 //By Graham Prophet
MicroVision & STMicroelectronics team on MEMS HUD technology
MicroVision (Redmond, Washington), active in ultra-miniature projection display and sensing technology; and STMicroelectronics are to work together to develop, sell, and market laser beam scanning (LBS), mirror-based laser beam scanning. The companies target pico projection, virtual and augmented reality (VR, AR), 3D sensing and ADAS applications.

The companies anticipate cooperating closely on market development efforts that will include joint sales and marketing activities for LBS solutions. In addition to the pico projection and heads-up display (HUD) markets that both companies are currently addressing with their LBS solutions, ST and MicroVision anticipate targeting emerging markets and applications including virtual and augmented reality (VR, AR), 3D sensing, and Advanced Driver Assistance Systems (ADAS).


MicroVision and ST anticipate exploring options to collaborate on future technology development including a joint LBS product roadmap. This cooperation would combine the process design and manufacturing expertise of ST with the LBS systems and solutions expertise of MicroVision.


The companies have an existing working relationship on production of MicroVision components. ST manufactures MicroVision’s current-generation MEMS die based on MicroVision’s design. ST also manufactures one of the ASICs sold by MicroVision.


MicroVision is the creator of PicoP scanning technology, an ultra-miniature laser projection and sensing solution based on its laser beam scanning methodology. MicroVision says its platform approach for this display and sensing solution means that it can be adapted to a wide array of applications and form factors; www.microvision.com


STMicroelectronics; www.st.com


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