At the same time, the MIPI Alliance introduced MIPI Automotive SerDes Solutions (MASS). MASS will provide automotive OEMs and suppliers with end-to-end high-performance connectivity solutions for the growing number of cameras, sensors and displays that enable automotive applications such as advanced driver-assistance systems (ADAS), connected in-vehicle infotainment (IVI) and, ultimately, fully autonomous vehicles. These solutions, with focus on even higher functional safety and security built in at the protocol level, will help automakers integrate new and emerging safety features such as low-latency backup cameras, lane-keeping and sign-detection sensors and 360-degree camera, lidar and radar systems. MASS also will support multiple high-resolution instrumentation, control and entertainment displays.
As the physical layer cornerstone, A-PHY's primary mission is to transfer high-speed data between cameras and displays and their related domain ECUs. Through the development of additional supporting specifications, MASS intends to allow proven higher-layer protocols from MIPI and third parties to operate over physical links spanning an entire vehicle, eliminating the need for proprietary “bridges” and PHYs. For OEMs and system integrators this equates to simplified networks and reduced costs, weight and development time.
MASS will address functional safety over heterogeneous protocols and numerous topologies, including daisy chaining, according to ISO 26262. System-level engineers can use this architecture to build systems that meet ASIL (Automotive Safety Integrity Level) requirements at any level, from ASIL B to ASIL D. MASS also will provide end-to-end security to include authentication, integrity and confidentiality for data protection of MASS camera, sensor and display components.
Among the companies participating jn the MIPI A-PHY subgroup are Bosch, Intel, ON Semiconductors, Qualcomm, Sony, STMicroelectronics, Synopsys and Valens.
More information: https://mipi.org/about-us