New radar sensors poach in the lidar area: Page 2 of 2

December 07, 2020 //By Christoph Hammerschmidt
New radar sensors poach in the lidar area
Razor-sharp images and a detailed picture of the environment - for this purpose, manufacturers of ADAS systems used to require a set of lidar sensors. Until now - because NXP has now introduced a new generation of radar sensor chips and processors that possibly are taking the lidar out of the field.

As we move into this future, NXP has now introduced a new generation of its radar semiconductor platform that is scalable and can be adapted to the task profile required. The combination of NXP's new S32R45 processors and TEF82xx transceivers designed specifically for radar applications delivers the angular resolution, processing power and range required for future tasks.

The platform is designed to meet cost-effective, compact NCAP Corner Radar requirements in production vehicles, while providing scalability for long range front radar and more demanding applications such as simultaneous operation of blind spot detection, lane change assistant or altimeter. These assistants require longer ranges and significantly better angular resolution to reliably detect and separately detect multiple objects around the vehicle. The combination of the new S32R294 radar processors and TEF82xx transceivers offers the necessary efficiency and flexibility to individually optimize the implementation for these applications, promises Feulner.

New Tasts, new solutions: NXP's suite of radar sensors and processors

The devices of the new sensor generation are manufactured in 16nm FinFet and 40nm RFCMOS technologies. With the 16nm FinFet technology, NXP is the first in this market, says Feulner. RFCMOS technology has been introduced at NXP for years and combines the advantages of low-cost CMOS manufacturing with the ability to process very high frequencies.

In order to unlock the performance of the new chip generation, NXP also supplies corresponding algorithms that can be used, for example, by the integrated hardware accelerators. All this is contained in a new, uniform development environment together with the Software Developers Kit (SDK), which the chip manufacturer provides. The new components are currently being sampled by customers and will be available in mass production in the course of 2021.

More information:


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