Nexperia shrinks discretes, targeting automotive applications
Nexperia’s automotive qualified discrete leadless packages range from the very small form factor DFN1006BD-2 (1 x 0.6 x 0.5 mm) up to DFN2020D-3 (2 x 2 x 0.65 mm), including the recently-released DFN1110D-3 and DFN1412D-3 styles. DFN devices can measure as small as 0.6 mm2 offering a PCB space-saving of up to 90 % when compared to current SOT23 devices. Due to their high thermal performance these packages stay cooler and improve overall system reliability, the vendor claims. The Nexperia DFN package technology supports a Tj capability of up to 175°C.
Because automated optical inspection (AOI) is vital for some applications – especially automotive – Nexperia pioneered the development of side-wettable flanks (SWF) for the DFN package in 2010 and devices with SWF are now a proven, accepted solution. This enables visible solder joints to be inspected post soldering. An additional benefit of DFN packages with SWF comes from the mechanical robustness of the bond to the PCB, which is better than devices without side-wettable flanks. SWF improve shear forces and board bending capabilities.
A large number of discrete semiconductors in DFN packages is already in volume production, and Nexperia will release more throughout 2020, resulting in the industry’s widest portfolio of such devices. Types available include, among others, standard, high-runner products such as BC847, BC817 and BAV99.
More information www.nexperia.com/automotiveDFN
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