Packaging protection for automotive electronics components

April 07, 2020 //By Julien Happich
Automotive packaging
Amkor's Edge Protection technology protects the edges of the device during test and Surface Mount Assembly (SMA) handling operations using MicroLeadFrame (MLF/QFN) packages.

The Edge Protection technology innovative package enhancement developed by Amkor strengthens the edges of the punch MLF package, resulting in a significant reduction in test and assembly induced damage.

The technology is available now on punch MLF packages in a variety of body sizes. The new technology is said to significantly reduce the possibility of gaps/cracks resulting from mechanical stress, offering added protection for all handling procedures.

This improves package strength and provides robust performance during burn-in and electrical ATE test insertions and eliminates Surface Mount Technology related incidents since placement equipment only touches Epoxy Molding Compound (EMC), with no contact of the leadframe during placement.

Packaging is a key issue for DC-DC point of load (PoL) converters as well as power management ICs (PMICs) and USB-C chargers used in automotive designs. 

Amkor Technology –

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