With the introduction of EDT2 (Electric Drive Train) technology in the EasyPACK and full automotive qualification, Infineon is expanding the application range of the module family to include traction inverters. The EDT2 chip technology ensures significantly lower losses than current products on the market and even outperforms Infineon's previous chip generation by 20 percent.
Another unique selling point of the EasyPACK is the plug-and-play approach, which simplifies module integration. Compared to classic discrete through-hole packages as well as the HybridPACK 1, soldering of the pins is no longer necessary. Infineon's PressFIT contact technology thus enables a reduction in assembly time. In addition, three EasyPACK 2Bs require 30 percent less space than a HybridPACK 1, offering not only a very compact but also a cost-effective design. Furthermore, the EasyPACK 2B EDT2 is fully qualified according to the AQG324 standard.
The new module bears the type designation FF300R08W2P2_B11A and can be ordered from October 2021.