Renesas integrates CEVA DSP into automotive SoCs

November 12, 2020 // By Christoph Hammerschmidt
Renesas integrates CEVA DSP into automotive SoCs
The Japanese chipmaker Renesas has licensed a new, high-performance DSP from CEVA Inc. to power its next-generation automotive System-on-Chip (SoC). The move strengthens Renesas’ capability to drive automotive sensor signal fusion and processing.

CEVA’s DSP-based solutions for the automotive market target demanding sensor processing and AI workloads associated with automated driving and electrification.The company’s NeuPro-S and SensPro products have already been licensed by multiple automotive semiconductors and OEMs to power a variety of intelligent processors ranging from ADAS systems in application fields such as imaging, driver monitoring systems, smart cameras, radar, V2X communications to battery management and powertrain platforms.

“In active safety and self-driving applications, DSP processing is a key IP for processing and segmenting sensor data generated by sensors on vehicles,” said Naoki Yoshida, Vice President of the Automotive Digital Products Marketing Division at Renesas. “CEVA’s automotive DSP solution helps us achieve the underlying processing capabilities required for the technological advances of our next-generation automotive SoC customers.”
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