The SensPro family serves as hub for processing and fusing of data from multiple sensors including camera, Radar, lidar, Time-of-Flight, microphones and inertial measurement units.
The new product line addresses the need for specialized processors to handle the proliferation of different types of sensors that are required in an extremely broad range of application scenarios, including automotive, smartphones, robotics, AR/VR headsets and for emerging industrial and medical applications that are being revolutionized with initiatives like Industry 4.0. These sensors, among which are camera, radar, lidar, time-of-flight (ToF), microphones and inertial measurement units (IMU), generate a multitude of data types and bit-rates derived from imaging, sound, RF and motion, which can be used to create a full 3D contextually-aware device.
Designed to maximize performance-per-watt for complex multi-sensor processing use cases, the SensPro architecture offers a combination of high performance single and half precision floating-point math required for high dynamic range signal processing, point cloud creation and deep neural network (DNN) training, along with a large amount of 8- and 16-bit parallel processing capacity required for voice, imaging, DNN inference processing and Simultaneous Localization and Mapping (SLAM). SensPro incorporates CEVA’s widely used CEVA-BX scalar DSP, which offers a seamless migration path from single sensory system designs to multi-sensor, contextual-aware designs.