Drawing on ST's automotive experience, its smart power technology and wide bandgap semiconductor materials, the STi²GaN family combines a monolithic integrated power stage with drivers and protection functions in GaN technology, as well as SiP (system-in-package) solutions for application-specific ICs with additional processing and drive circuitry. The STi²GaN solutions use ST's new bonding wire-free package technology to achieve a high level of robustness, reliability and performance.
With STi²GaN, the manufacturer aims to continue its success story in composites and smart power product innovations. The new product range primarily targets automotive applications and the demands for high density, reliability and performance. The first STi²GaN solutions are intended for on-board chargers, lidar systems for autonomous driving, bidirectional DC/DC converters, class D amplifiers and power conversion systems. With GaN's high power density and efficiency, the chipmaker aims to realise a range of scalable, compact devices in 100 V and 650 V clusters, the company said.