Thermistors are suitable for conductive bonding

December 08, 2020 // By Christoph Hammerschmidt
Thermistors are suitable for conductive bonding
TDK has expanded its range of chip NTC thermistors of the NTCSP series for mounting by conductive bonding. The components are intended for non-contact temperature measurement in automotive applications; with their high temperature stability they can be used, for example, inside transmissions and engines.

In response to the demand for different mounting methods, the new chip NTC thermistors with AgPd connections, which allow mounting by conductive bonding, are now available. They are ideal for applications where soldering is difficult.

With its wide operating temperature range from -55 ℃ to 150 ℃, the NTCSP series can be used for various temperature measurement and compensation tasks in low to high temperature ranges. They are extremely reliable and certified to AEC-Q200, the worldwide automotive standard for passive components.

The new components of the NTCSP series are available as types with 10 kΩ, 47 kΩ and 100 kΩ and dimensions of 1.0 × 0.5 mm and 1.6 × 0.8 mm3.

Further information: https://product.tdk.com/info/en/catalog/datasheets/503022/tpd_automotive_ntc-thermistor_ntcsp_en.pdf


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