Ultra-compact MOSFETs are optimised for automotive applications

November 02, 2020 //By Christoph Hammerschmidt
Ultra-compact MOSFETs are optimised for automotive applications
Semiconductor manufacturer Rohm is launching a series of ultra-compact MOSFETs under the type designation RV8C010UN, RV8L002SN and BSS84X. With a DFN100 package measuring just 1.0 x 1.0 mm, they are ideal for applications where space is at a premium. With their automotive qualification according to AEC Q101, they are well suited for use in vehicle control units and ADAS.

Rohm's new MOSFETs feature an approximately 85% smaller mounting area and up to 65% better heat dissipation compared to SOT-23 packages. They feature turn-on resistances of typically 340 milliohms to 3.5 ohms (@Vgs = 4.5 V) and drain-source voltages of 20 V, 60 V and -60 V. The drain current is 1.0 A, 0.25 A and -0.25 A respectively. The control voltage is specified with 1.2 V, 2.5 V and -4.5 V. In addition, the Wettable-Flank technology guarantees the electrode height of 125 µm required for automotive applications.

To ensure the reliability of automotive components, an automatic optical inspection (AOI) is carried out after assembly. In the case of components with bottom electrodes, however, the solder joint cannot be verified because the connections are not visible. This makes a visual inspection according to automotive standards difficult. ROHM has solved these problems with its proprietary Wettable-Flank technology, which guarantees an electrode height of 125 µm for package sizes of 1.0 mm × 1.0 mm, which has increased acceptance by a number of vehicle manufacturers.

AOI ensures extremely high solder assembly reliability in automotive systems that demand high quality. The new package with bottom electrode supports both increased miniaturisation and high heat dissipation.

More information: https://www.rohm.com/

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